Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
US7355277B2 · kind B2 · utility
23Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Dec 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.