Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
US7355428B2 · kind B2 · utility
41Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Jan 14, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing or burn-in phase. In one embodiment, the system includes a miniature liquid-cooled heat sink device having a monolithic counter-flowing structure. In other embodiments, the system includes a heater, a flow control valve, a controller, and/or sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.