Heat sink for surface-mounted semiconductor devices and mounting method

US7355858B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gerold Gruendler · Regensburg, DE
• Juergen Hoegerl · Regensburg, DE
• Thomas Killer · Hohenschambach, DE
• Volker Strutz · Tegernheim, DE
• Erich Syri · Wenzenbach, DE

Key dates

• Filing date: Mar 15, 2006
• Grant date: Apr 8, 2008
• Expiry date: May 18, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.