Polishing pad
US7357704B2 · kind B2 · utility
1Cited by
39References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2006 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Jun 15, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.