Substrate conductive post formation
US7358116B2 · kind B2 · utility
0Cited by
24References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate with at least one conductive post formed prior to the formation of an inter-layer dielectric (ILD) coating on the substrate. The conductive post may be formed from a metal layer of the substrate. Additionally, the conductive post may be built up on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.