Boyd Coomer
6Patents
2h-index
4Co-inventors
33Inventor score
Filing activity: Jan 11, 2002 → Aug 11, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6899815B2 | Multi-layer integrated circuit package | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6974775B2 | Method and apparatus for making an imprinted conductive circuit using semi-additive plating | Electricity | 4 | Expired |
| US7637008B2 | Methods for manufacturing imprinted substrates | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7245001B2 | Multi-layer integrated circuit package | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6777648B2 | Method and system to manufacture stacked chip devices | Electricity | 0 | Expired |
| US7358116B2 | Substrate conductive post formation | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.