Patent · US Expired

Method of fabricating semiconductor integrated circuits

US7358199B2 · kind B2 · utility

1Cited by
16References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 9, 2005
Grant dateApr 15, 2008
Priority date—
Expiry dateMay 6, 2026

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/12
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of fabricating semiconductor integrated circuits includes (1) providing a spin-on tool comprising a rotatable platen for holding and spinning a wafer disposed thereon, a fluid supply system for providing spin-on solution onto the wafer, and a detector fixed in a position above the wafer, wherein the wafer has a radius R; (2) spin-on coating the wafer by depositing the spin-on solution onto surface of the wafer from its center and spinning-off to leave a spin coat material layer; and (3) spinning the wafer and scanning the spin coat material layer by impinging an incident light beam emanated from the fixed detector and detecting a reflected light beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.