Architecture and method of fabrication for a liquid metal microswitch (LIMMS)
US7358452B2 · kind B2 · utility
2Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Mar 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2029/008
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.