Benjamin P. Law
11Patents
6h-index
21Co-inventors
66Inventor score
Filing activity: Jun 7, 1999 → May 24, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6421212B1 | Thin film read head structure with improved bias magnet-to-magnetoresistive element interface and method of fabrication | Emerging Cross-Sectional Technologies | 174 | Expired |
| US6833979B1 | Structure and method for redeposition free thin film CPP read sensor fabrication | Emerging Cross-Sectional Technologies | 174 | Expired |
| US6433970B1 | Structure and method for redeposition free thin film CPP read sensor fabrication | Emerging Cross-Sectional Technologies | 164 | Expired |
| US6487056B1 | Thin film read head structure with improved bias magnet-to-magnetoresistive element interface and method of fabrication | Emerging Cross-Sectional Technologies | 160 | Expired |
| US6735850B1 | Thin film read head structure with improved bias magnet-to-magnetoresistive element interface and method of fabrication | Emerging Cross-Sectional Technologies | 158 | Expired |
| US7111382B1 | Methods for fabricating redeposition free thin film CPP read sensors | Emerging Cross-Sectional Technologies | 156 | Expired |
| US6681496B2 | Method of active fiber alignment with movable V-groove precision control microstructures | Physics | 4 | Expired |
| US8314487B2 | Flange for semiconductor die | Emerging Cross-Sectional Technologies | 3 | Active |
| US7358452B2 | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) | Electricity | 2 | Expired |
| US11488923B2 | High reliability semiconductor devices and methods of fabricating the same | Electricity | 0 | Active |
| US8604609B2 | Flange for semiconductor die | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.