Packaging structure of a light-sensing element and fabrication method thereof
US7358482B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Jan 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
Abstract
The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is installed to the substrate with a glue material in order to envelop the light-sensing chip. Thereby, the present invention not only can clean pollutants completely and promote the yield, but also can reduce the packaging area. In the present invention, the engagement portions may also be formed on the substrate and the light transparent cover so that the alignment can be undertaken easily.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.