Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
US7359211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2004 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Sep 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier disposed local to the passive component site and spaced apart from the active component site. The fluid flow barrier can be a recess that resists fluid flow thereinto because of surface tension of the fluid when it meets the recess edge. The fluid flow barrier can include a boundary that diverts fluid flow due to the angle of the recess edge as the fluid approaches it. An embodiment also includes a packaging system that includes the article and at least one passive component. An embodiment also includes a method of assembling the article or the packaging system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.