Electrical/optical integration scheme using direct copper bonding
US7359591B2 · kind B2 · utility
21Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2006 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Jul 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electro-optic semiconductor package and fabrication method provides enhanced performance. An integrated circuit (IC) having one or more IC contact pads is provided, where the IC contact pads are connected to an IC on the IC wafer. An intermediate wafer having one or more intermediate contact pads is provided, where the intermediate contact pads are connected to an electro-optic arrangement on the intermediate wafer. The method further provides for direct copper bonding the IC contact pads to adjacent intermediate contact pads such that an electro-optic semiconductor package results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.