Process condition sensing wafer and data analysis system
US7360463B2 · kind B2 · utility
9Cited by
25References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2003 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Oct 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.