Method for the production of a soldered connection
US7360679B2 · kind B2 · utility
2Cited by
13References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2002 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Aug 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/111
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece of solder material is at least partially melted off. The at least partially melted off formed piece of solder material being thrust against a bonding arrangement in such a way that both bonding partners are wetted in a bonding area to establish an electrically conductive bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.