Apparatus for interfacing electronic packages and test equipment
US7362114B2 · kind B2 · utility
7Cited by
133References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2004 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Jun 1, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06722
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.