Magnetoresistive/inductive write head assembly formed with seed layers having a uniform thickness
US7362543B2 · kind B2 · utility
2Cited by
17References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2005 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Feb 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.