Method of manufacturing a multilayer printed wiring board
US7363706B2 · kind B2 · utility
3Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 25, 2005 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Oct 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention provides a multilayer printed wiring board having flat via holes. This is a multilayer printed wiring board formed by alternately laminating multiple metal foils and insulating layers, in which an interlayer connection via pad provided in a first insulating layer, a wiring circuit and an interlayer connection via bottom pad of a second insulating layer are provided in the same surface layer and at least the interlayer connection via pad and the interlayer connection via bottom pad of the second insulating layer have the same thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.