Metal matrix composite material with high thermal conductivity and low coefficient of thermal expansion
US7364692B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2005 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | May 9, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Metal-matrix composites with combinations of physical and mechanical properties desirable for specific applications can be obtained by varying and controlling selected parameters in the material formation processes, particularly by increasing the microstructural homogeneity of the composite, while maintaining a constant mixture ratio or volume fraction. In one embodiment of the invention, a CuSiC composite having increased thermal conductivity is obtained by closely controlling the size of the SiC particles. In another embodiment of the invention, AlSiC composites which exhibit increased ultimate tensile and yield strengths are made by closely controlling the size of SiC and Al particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.