Laser beam processing method and laser beam machine
US7364986B2 · kind B2 · utility
115Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2004 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jan 21, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser beam processing method comprising the step of processing-feeding a wafer having devices which are formed in a large number of areas sectioned by streets arranged in a lattice pattern on the front surface while a laser beam capable of passing through the wafer is applied to the wafer to form deteriorated layers along the streets in the inside of the wafer, wherein the laser beam is applied at a predetermined angle toward a direction intersecting at right angles to the processing-feed direction relative to a direction perpendicular to the laser beam applied surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.