Semiconductor device with semiconductor components connected to one another
US7365438B2 · kind B2 · utility
6Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jul 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor device which provides a shortest possible connection between two semiconductor components 10a and 10b arranged in a manner lying opposite on a substrate 2. The two semiconductor components 10a and 10b are in each case arranged with their chip contact-connection regions 11a and 11b facing the substrate 2. A vertical through-plating device 20 connects the two chip contact-connection regions 11a and 11b.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.