Edge normal process
US7366344B2 · kind B2 · utility
6Cited by
8References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2006 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jan 13, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.