Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups
US7367866B2 · kind B2 · utility
1Cited by
1References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 18, 2005 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Dec 7, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.