Electroplating apparatus including a real-time feedback system
US7368042B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Aug 5, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electro-chemical plating system includes an upper rotor assembly for receiving and holding a wafer; an electroplating reactor vessel for containing plating solution in which the wafer is immersed; an anode array including a plurality of concentric anode segments provided inside the electroplating reactor vessel; a power supply system including power supply subunits for controlling electrical potentials of the anode segments, respectively; and a plurality of sensor devices mounted inside the upper rotor assembly, wherein the sensor devices are substantially arranged in corresponding to the anode segments, and during operation, the plurality of sensor devices are utilized for in-situ feeding back a deposition profile to a control unit in real time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.