MEMS packaging using a non-silicon substrate for encapsulation and interconnection
US7368808B2 · kind B2 · utility
29Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2003 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Aug 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.