Micro-electro-mechanical system (MEMS) package having metal sealing member
US7368816B2 · kind B2 · utility
8Cited by
3References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 12, 2005 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Oct 19, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side sealing member on a side surface of the substrate; and covering the lid and the substrate with a metal sealing member, thus hermetically sealing the MEMS element from the external environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.