Ohk Kun Lim
4Patents
3h-index
9Co-inventors
33Inventor score
Filing activity: Apr 20, 2005 → Feb 3, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7394139B2 | Optical modulator module package using flip-chip mounting technology | Electricity | 19 | Active |
| US7368816B2 | Micro-electro-mechanical system (MEMS) package having metal sealing member | Performing Operations; Transporting | 8 | Expired |
| US7116456B2 | Light modulator module package | Physics | 3 | Expired |
| US7289258B2 | Light modulator having variable blaze diffraction grating | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.