BGA semiconductor chip package and mounting structure thereof
US7368821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Nov 10, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate, wherein the I/O solder balls are electrically connected to the semiconductor chip and the dummy solder balls are electrically isolated from the semiconductor chip, and the I/O solder balls and the dummy solder balls have the same ball size and ball pitch and are uniformly provided over the second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.