Modified electroplating solution components in a low-acid electrolyte solution
US7371311B2 · kind B2 · utility
3Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2003 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Feb 12, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within die thickness variations to a specified value. For one embodiment of the invention, the leveler and suppressor are increased to reduce within die thickness variations and substantially reduce a plurality of electroplating defects. In such an embodiment the combined concentration of leveler and suppressor is determined to maintain adequate gap fill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.