Method of fabricating light emitting diode package
US7371603B2 · kind B2 · utility
9Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2006 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Nov 9, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/974
Abstract
The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.