Multilayer printed wiring board
US7371974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2002 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Mar 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered printed circuit board includes a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition. The conductor circuits between which the interlaminar resin insulating layer is sandwiched are connected by a via-hole. The via-hole includes at least one of Cu, Ni, Pd, Co, W and their alloys. Via-holes in different level layers among the via-holes are formed so as to form the stack-via structure. At least one of the land diameters of the via-holes in different level layers is different from the land diameters of other via-holes in different level layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.