Yoichiro Kawamura
26Patents
9h-index
22Co-inventors
71Inventor score
Filing activity: May 12, 1997 → Sep 14, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6010768A | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6251502A | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6342682B1 | Printed wiring board and manufacturing method thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6217988A | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Emerging Cross-Sectional Technologies | 22 | Expired |
| US7371974B2 | Multilayer printed wiring board | Electricity | 22 | Expired |
| US6384344B1 | Circuit board for mounting electronic parts | Electricity | 21 | Expired |
| US6831234B1 | Multilayer printed circuit board | Electricity | 16 | Expired |
| US7714233B2 | Printed wiring board | Emerging Cross-Sectional Technologies | 10 | Active |
| US6316738A | Printed wiring board and manufacturing method thereof | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7475803B2 | Solder ball loading method and solder ball loading unit background of the invention | Emerging Cross-Sectional Technologies | 7 | Expired |
| US8017875B2 | Printed wiring board | Electricity | 5 | Active |
| US8198546B2 | Printed wiring board | Emerging Cross-Sectional Technologies | 5 | Active |
| US8222539B2 | Wiring board and method for manufacturing the same | Emerging Cross-Sectional Technologies | 4 | Active |
| US7472473B2 | Solder ball loading apparatus | Emerging Cross-Sectional Technologies | 4 | Active |
| US8003897B2 | Printed wiring board | Emerging Cross-Sectional Technologies | 3 | Active |
| USRE44251E1 | Circuit board for mounting electronic parts | General | 3 | Expired |
| US8525041B2 | Multilayer wiring board and method for manufacturing the same | Emerging Cross-Sectional Technologies | 3 | Active |
| US8022314B2 | Printed wiring board | Electricity | 3 | Active |
| US8001683B2 | Solder ball loading method | Emerging Cross-Sectional Technologies | 2 | Active |
| US8030579B2 | Multilayer printed wiring board | Electricity | 2 | Active |
| US7866529B2 | Solder ball loading method and solder ball loading unit | Emerging Cross-Sectional Technologies | 1 | Active |
| US9040843B2 | Multilayer printed wiring board | Electricity | 1 | Active |
| US8624132B2 | Printed wiring board | Electricity | 1 | Active |
| US8832935B2 | Method of manufacturing a printed wiring board | Emerging Cross-Sectional Technologies | 1 | Active |
| US8324512B2 | Multilayer printed wiring board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.