Method for laser micromachining
US7371993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Apr 1, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of laser micro-machining a work piece, with a laser, including the steps of: locating the workpiece on a carrier forming a part of a transport system, the carrier can be displaced along a path parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by an output beam from the laser at a working datum position defined relative to the path which path is established by the transport system to traverse the first datum position; a plane defined by the X- and Y-axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.