Microelectronic package having a stiffening element and method of making same
US7372133B2 · kind B2 · utility
5Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2005 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Feb 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.