Dale Hackitt
6Patents
5h-index
9Co-inventors
52Inventor score
Filing activity: Jun 1, 1995 → Aug 31, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8890628B2 | Ultra slim RF package for ultrabooks and smart phones | Emerging Cross-Sectional Technologies | 57 | Active |
| US5489805A | Slotted thermal dissipater for a semiconductor package | Electricity | 24 | Expired |
| US6972152B2 | Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7190068B2 | Bottom heat spreader | Electricity | 12 | Expired |
| US7372133B2 | Microelectronic package having a stiffening element and method of making same | Electricity | 5 | Expired |
| US7638867B2 | Microelectronic package having solder-filled through-vias | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.