Patent · US Expired

Vertical conduction power electronic device package and corresponding assembling method

US7372142B2 · kind B2 · utility

4Cited by

2References

20Claims

0Family size

Assignee

STMicroelectronics SA

Inventors

Maurizio Maria Ferrara · Catania, IT
Angelo Magri · Mascalucia, IT
Agatino Minotti · Trecastagni, IT

Key dates

Filing date	May 31, 2005
Grant date	May 13, 2008
Priority date	—
Expiry date	Jul 28, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sides of the first die. The first conduction terminal being in contact with said metal frame and comprising at least an intermediate frame arranged in contact with said second conduction terminal.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.