Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas
US7372408B2 · kind B2 · utility
139Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2006 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Jan 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.