Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
US7374471B2 · kind B2 · utility
1Cited by
7References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 27, 2004 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Feb 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more pivotable load-and-unload cups to transfer the objects to and/or from one or more object carriers to polish the objects. Each pivotable load-and-unload cup may be configured to transfer the objects to and/or from a single object carrier. Alternatively, each pivotable load-and-unload cup may be configured to transfer the objects to and/or from two object carriers. The pivotable load-and-unload cups may be configured to be pivoted about one or more pivoting points over at least one polishing surface, such as a polishing pad surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.