Method of forming a thin film component
US7374984B2 · kind B2 · utility
38Cited by
8References
26Claims
0Family size
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Feb 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6739
Abstract
Embodiments of methods, apparatuses, devices, and/or systems for forming a thin film component are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.