Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
US7375155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2005 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Jul 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0254
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1],wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.