Wirebonded device packages for semiconductor devices having elongated electrodes
US7375424B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 2, 2006 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | May 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package includes at least one semiconductor device having at least one electrode of an elongated length. The device package also includes at least one conductive pad that extends parallel to the elongated length of the electrode. A terminal lead may be integral with the conductive pad. A plurality of wirebonds of about the same length may electrically connect the conductive pad and the elongated electrode of the semiconductor device. As another alternative, a second semiconductor device may be mounted to the conductive pad and a plurality of wirebonds may electrically connect this second device and the elongated electrode of the first semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.