Semiconductor chip with flexible contacts at a face
US7375434B2 · kind B2 · utility
2Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2004 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Sep 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor chip comprising a semiconductor element, at least a conducting line and a contact area being arranged on the semiconductor element, the conducting line being connected with the contact area, the contact area being disposed for contacting another electrical contact, characterised in that the semiconductor element comprises at a face of the semiconductor element a flexible arm formed out of the semiconductor element and the contacting area being arranged on the arm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.