Semiconductor wafer baking apparatus
US7377776B2 · kind B2 · utility
1Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2005 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Jul 14, 2026 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27B17/0025
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.