Signal transmission structure and circuit substrate thereof
US7378601B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2005 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | May 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09645
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall of a through hole in the core layer of a circuit substrate. The conductive wall has a semi-circular or a C-shaped structure. Therefore, when a signal passes the conductive via and the via land of the circuit substrate through the conductive wall in the interior of the via, because of a more continuous impedance between the via land and the conductive wall, signal reflection due to impedance mismatch along the signal transmission pathway can be reduced to enhance signal transmission quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.