Electronic component mounting package and package assembled substrate
US7378728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2006 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | May 6, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.