Stacked contact bump
US7378734B2 · kind B2 · utility
7Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2006 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | May 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.