Semiconductor wafer inspection system
US7379826B2 · kind B2 · utility
1Cited by
60References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2006 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Aug 15, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/0095
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for identifying a defect or contamination on a surface of a material. The method and system involves providing a material, such as a semiconductor wafer, using a non-vibrating contact potential difference sensor to scan the wafer, generate contact potential difference data and processing that data to identify a pattern characteristic of the defect or contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.