Patent · US Expired

RFID tag with bist circuits

US7380190B2 · kind B2 · utility

22Cited by

40References

18Claims

0Family size

Assignee

Impinj, Inc. · US

Inventors

Dennis Kiyoshi Hara · Bellevue, US
Robert M. Glidden · Rancho Palos Verdes, US

Key dates

Filing date	Dec 15, 2004
Grant date	May 27, 2008
Priority date	—
Expiry date	Oct 3, 2025

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/318511
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Technologies suitable for on-wafer testing in the ubiquitous computing era are disclosed. Among the inventive features disclosed are: 1) clustering of wafer test probe landing area sites for parallel test sequencing; 2) on wafer test wiring that runs along the wafer's scribe regions; 3) on-wafer test wiring that can be scribed and yet thwart the spread of contamination into the product die; 4) an RFID tag design that allows for on-wafer testing without imposing substantial semiconductor surface area penalty; 5) an RFID tag design that includes built-in self test (BIST) circuitry for the RFID tag's non-volatile memory.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.