Method and apparatus for process control in time division multiplexed (TDM) etch processes
US7381650B2 · kind B2 · utility
4Cited by
11References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2005 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Mar 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/2544
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for controlling pressure in a chamber during a time division multiplexed process. A throttle valve is positioned based on an open-loop pressure control algorithm within at least one step of the time division multiplexed etch process. A pressure response of the step is evaluated and compared to a desired pressure response. The throttle valve is then positioned through a proportional, integral and derivative controller step to step of the time division multiplexed etch process based on the evaluation to the desired pressure response.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.