Method of detecting an edge bead removal line on a wafer
US7382450B2 · kind B2 · utility
3Cited by
1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2006 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Jul 26, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
To determine an edge bead removal line (17) on a wafer (10), first lines or edges (38, 40, 42, 44) in the edge area (19) of the wafer (10) are detected. A first line area (48) and a second line area (50) are defined on either side of these lines (38, 40, 42, 44). The structures (36) present in these edge areas (48, 50) are compared to each other. From the result of the comparison it is determined whether or not an edge bead removal line (17) is present.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.