Method and apparatus for optimizing heat transfer with electronic components
US7382620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2005 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Mar 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.